Epoxy resin/hollow glass microspheres composite materials with low dielectric constant and excellent mechanical performance

Abstract The materials with low dielectric constant and loss are vital for high integration degree of the circuit board. Although many polymers like epoxy resin exhibit excellent comprehensive performance, their is unable to satisfy electronic packaging application. In this work, we present a simple grafting strategy via reaction between hollow glass microsphere polyhedral oligomeric silsesquioxane followed by blending fabricate microspheres composite materials. superior heat resistance (HGM) can improve thermal performance composites. Due addition Ge‐POSS, P‐HGM exhibited good interfacial compatibility matrix forms an adhesion region. With loading 20 wt%, fabricated 2.59 0.0145. At same time, tensile strength, impact strength flexural were 42.15 MPa, 24.33 kJ/m 2 90.82 respectively, which demonstrated that processed superb mechanical behavior. It suggests method promising potential fabricating